PROGRAMME
DIVISIONS
- All Divisions
- BUILT ENVIRONMENT AND ENGINEERING DESIGN (BE)
- BASIC SCIENCE (BS)
- CHEMICAL ENGINEERING AND MATERIAL SCIENCE (CM)
- ENVIRONMENT AND ENERGY (EE)
- ELECTRICAL/ELECTRONICS ENGINEERING, & INFORMATION TECHNOLOGY (EI)
- LIFE SCIENCE & HEALTH (LH)
- MEDICAL SCIENCE & ENGINEERING (ME)
- MECHANICAL AND AEROSPACE TECHNOLOGY (MA)
- MARINE AND OCEAN ENGINEERING (MO)
- NUCLEAR AND FUSION TECHNOLOGY (NF)
- WOMEN IN S&T (WS)
- MULTIDISCIPLINARY RESEARCH (MR)
- POSTER SESSION
ELECTRICAL/ELECTRONICS ENGINEERING, & INFORMATION TECHNOLOGY (EI)
The ongoing integration of electrical engineering, electronics, and information technology is a central driver of the digital transformation shaping contemporary society. From innovations in semiconductors, imaging technologies, and implantable biomedical systems to emerging paradigms in 6G networks and AI foundation models, this multidisciplinary field is reshaping how we connect and interact across both physical and digital environments.
At EKC2025, the Electrical, Electronics Engineering & Information Technology (EI) division presents nine focused sessions, each highlighting recent advances at the frontier of research and innovation. The topics span a wide range of emerging technologies, including next-generation telecommunication networks, artificial intelligence, data science, photo-detecting and imaging, semiconductor technologies, healthcare innovations, and smart mobility.
(To learn more about each session, click the EI division in the left column.)
Programme Committee
_20250115145829.jpg)
_20250115145942.jpg)
| Date / Time | 2025-08-27 13:00 -- 14:30 |
|---|---|
| Room | FH3 |
| Conveners / Chairs |
|
| Synopsis | As the research community embarks on the journey towards 6G networks, the telecommunications landscape is poised for groundbreaking advancements and innovations. This session will serve as a platform for exploring the cutting-edge developments and future directions of 6G technology, bringing together experts from various domains to share their insights and research findings.
Given the early stages of 6G research, the session will cover a broad spectrum of topics that reflect the diverse interests and expertise of our invited speakers. Potential areas of discussion may include Joint Sensing and Communication, Quantum Communication, Non-territorial Networks, and other emerging technologies that are expected to shape the 6G era.
The session aims to provide a comprehensive overview of the current state of 6G research, highlighting the collaborative efforts of global companies, research institutes, and nations. Emphasis will be placed on the ambitious framework and objectives set forth by standardization bodies such as the ITU-R, 3GPP, and ETSI.
Attendees will gain insights into the multifaceted aspects of 6G, including technological innovations, network architecture, and the integration of new communication paradigms. Discussions may explore the role of artificial intelligence (AI) and machine learning in network management, the potential for decentralized business models, and the importance of achieving energy efficiency and interoperability.
By bringing together leading voices in the field, this session aims to provide a holistic view of the technological innovations and practical challenges that lie ahead in 6G research. Join us to explore how 6G will pave the way for a new era of global connectivity and meet the evolving needs of users and industries alike. The session will also serve as a valuable platform for computer scientists, network engineers, and industry professionals to engage in meaningful discussions and collaborations.
|
| Speakers |
|
| Date / Time | 2025-08-27 15:00 -- 16:30 |
|---|---|
| Room | FH3 |
| Conveners / Chairs |
|
| Synopsis | Recent breakthroughs in artificial intelligence (AI) have rapidly expanded the scope of computer vision (CV). From convolutional neural networks (CNNs) to Transformer-based architectures—and the emergence of large-scale vision-language models (VLMs)—modern CV systems are more powerful and versatile than ever. Meanwhile, generative AI has unlocked new possibilities in content creation, data augmentation, and multimodal learning.
Yet the practical deployment of these models across diverse environments—from lowpower edge devices to large-scale cloud systems—poses significant challenges. Ensuring efficiency and robustness calls for specialized techniques in model compression (pruning, quantization, knowledge distillation) and strategies for secure, scalable AI. Moreover, the concept of “foundation models” promises flexible, general-purpose backbones for various tasks, while also raising essential considerations about data quality, fairness, and interpretability.
This session aims to advance our collective understanding of how to balance cutting-edge research with real-world feasibility. By highlighting best practices and open challenges, we aim to inspire collaboration among researchers, practitioners, and industry professionals—ultimately shaping the future directions of Vision AI. |
| Speakers |
|
| Date / Time | 2025-08-27 16:50 -- 18:20 |
|---|---|
| Room | FH3 |
| Conveners / Chairs |
|
| Synopsis | In the age of big data, understanding the underlying rules governing complex systems is more crucial than ever. This session explores the intersection of statistical physics, complexity science, and network science to reveal hidden patterns, understand collective behaviors, and ultimately enable us to better predict and control complex systems in the real world.
The session will cover recent advances in methodologies such as network analysis, agent-based modeling, and machine learning, demonstrating how these tools contribute to building a unified theory of complex systems that spans diverse domains. Topics include the application of statistical physics and network science to understand emergent phenomena in large-scale social, economic, biological, and physical networks.
By bringing together perspectives from statistical mechanics, data science, and systems modeling, this session will illustrate how interdisciplinary research is uncovering universal patterns that underlie diverse complex phenomena.
|
| Speakers |
|
| Date / Time | 2025-08-28 09:00 -- 10:30 |
|---|---|
| Room | FH3 |
| Conveners / Chairs |
|
| Synopsis | Image sensors have become an essential part of most categories of electronic devices. Sensibility is gaining traction next to imaging, which targets as good as possible replication of human vision. Here, the acquisition of specific information trumps the aesthetics of photography. One of the trending topics in sensing is infrared sensing, especially in the short-wave infrared (SWIR), which can provide new information beyond human vision. Up to now, this modality has been limited to high-end applications, justified by the very high cost of the sensor based on III-V and II-VI materials manufactured with high-temperature epitaxial growth at low throughput, and then hybridized to the readout chip typically by die-to-die bonding. With the advent of disruptive technologies that can support wafer-level, semiconductor-fab-compatible manufacturing, the SWIR range can finally be democratized with sensors manufactured at a cost approaching CMOS image sensors once high volume capacity becomes more established.
Image sensors using thin-film photoactive layers should be seen as a new technology platform that can be customized depending on the application. A stack of materials (each with submicron thickness) is built monolithically on top of the readout circuit (which can be based on CMOS or TFT). Each stack contains at least the absorber layer (colloidal quantum dots, organic polymers or small molecules, or perovskite). This layer is sandwiched between electron and hole transport layers (ETL/HTL), and their order defines the polarity of the photodiode. Additional layers such as light-manipulating ones (e.g. metasurfaces below or filters above) or encapsulation can be added to adjust specific features. The photodiode and pixel can be tuned largely separately, and the spatial metrics (e.g. pixel size or resolution) are defined only by the underlying readout technology. Image sensors using thin-film photoactive layers should be seen as a new technology platform that can be customized depending on the application. A stack of materials (each with submicron thickness) is built monolithically on top of the readout circuit (which can be based on CMOS or TFT). Each stack contains at least the absorber layer (colloidal quantum dots, organic polymers or small molecules, or perovskite). This layer is sandwiched between electron and hole transport layers (ETL/HTL), and their order defines the polarity of the photodiode. Additional layers such as light-manipulating ones (e.g. metasurfaces below or filters above) or encapsulation can be added to adjust specific features. The photodiode and pixel can be tuned largely separately, and the spatial metrics (e.g. pixel size or resolution) are defined only by the underlying readout technology.
|
| Speakers |
|
_20250704110421.jpg)
| Date / Time | 2025-08-28 11:00 -- 12:30 |
|---|---|
| Room | FH3 |
| Conveners / Chairs |
DR. CHOI, Heungjae
Lecturer, Cardiff Unviersity |
| Synopsis | Cutting-edge semiconductor technologies, including wide bandgap compound semiconductors (e.g., SiC, GaN), innovative materials for devices and packaging (e.g., diamonds), and advancements in optoelectronics, alongside next-generation wired and wireless communication systems, are driving unprecedented advancements in shaping future societies. Furthermore, the exceptional properties of electromagnetic waves provide a foundation for RF and microwave technology to serve as a platform for interdisciplinary research, addressing global challenges such as non-invasive monitoring of physiological signals and the rapid diagnosis of infectious diseases.
This session seeks to bring together researchers from fundamental sciences and industry engaged in interdisciplinary projects utilizing RF and microwave technology. Particular emphasis will be placed on the design, fabrication, and implementation of advanced microwave sensing devices and their diverse applications. Additionally, the session will explore the critical role of high-power amplifiers in enabling these technologies, particularly in driving enhancing sensor performance, and supporting high-energy applications in biomedical research, material characterization, and wireless communication systems. The discussion aims to foster collaboration and innovation in the use of high-power amplifiers as integral components of modern RF and microwave platforms for tackling real-world challenges.
|
| Speakers |
|
| Date / Time | 2025-08-28 13:30 -- 15:00 |
|---|---|
| Room | FH3 |
| Conveners / Chairs |
PROF. KIM, Kwantae
Aalto University, Finland |
| Synopsis | This session brings together interdisciplinary advancements at the intersection of biomedical engineering, nutrition science, and integrated circuit (IC) design to address the evolving needs of personalized and connected healthcare.
1. A clinical trial on the Mediterranean Proper Optimal Balance (MEDi-PoB) diet, showing improved metabolic health and gene expression in overweight breast cancer survivors.
2. Innovations in neural interface ICs, focusing on dynamic range enhancement and low-noise design for robust closed-loop brain-machine interfaces.
3. Ultra-low-power IC designs for wearable bioimpedance sensors, demonstrating sub-10μW operation and validated open-source circuits for physiological monitoring.
Together, these works will introduce emerging technologies enabling efficient, precise, and personalized health interventions. |
| Speakers |
|
| Date / Time | 2025-08-28 16:30 -- 18:00 |
|---|---|
| Room | FH3 |
| Conveners / Chairs |
|
| Synopsis | There have been increased demands for the packaging technology between the existing Si chip and the emerging flexible substrate because new applications such as wearable device and implantable medical devices have been recently introduced. For this purpose, the system integration and packaging have to be tailored to the desired application. Especially, packaging miniaturization of implantable advanced medical device such as neural interface becomes more and more important because it has been tremendously matured nowadays. Existing packaging technologies based on chip-on-board connected by wire-bonding or solder ball may not provide a desired solution due to the limit of minimum package size which is not acceptable for the implantable neural interface systems. Material properties mismatches between conventional packaging board and neural interface devices are also technological barriers to achieve packaging miniaturization. Furthermore, standard interconnect methods for Si chip couldn’t be applied to flexible substrates which are more sensitive to high temperature and high pressure and fine pitched Si chip may not be integrated with conventional PCB substrate due to non-matching of fine pitch requirement. A bonding technology on flexible substrates with smaller chips is required to ensure reliability of the bonded joints because higher strain is applied to them when the chip size is larger than the flexible substrate’s radius of curvature. To this end, this session will bring the scientific experts of the field and industries together to find a pathway for new opportunities. |
| Speakers |
|
| Date / Time | 2025-08-27 13:00 -- 14:30 |
|---|---|
| Room | SGU06A |
| Conveners / Chairs |
|
| Synopsis | This session will bring together experts from KETI and industry leaders, alongside Fraunhofer Institutes participating in the Ministry of Trade, Industry, and Energy’s (MoTIE) “Advanced Strategic Industry Super-Gap Technology Development” program, to discuss advancements in advanced semiconductor packaging technologies and glass substrates, which hold promising potential for next-generation packaging solutions. Glass interposers, in particular, are a focus of active research due to their unique advantages in achieving high-density interconnections and superior electrical properties.
Participants will share insights into ongoing R&D efforts, explore collaborative opportunities, and outline the future roadmap for fostering stronger Korea-Germany partnerships. This session also aims to set the stage for broader engagement between Korea and Europe in advanced packaging technologies, paving the way for innovation and global collaboration.
|
| Speakers |
|
| Date / Time | 2025-08-28 16:30 -- 18:00 |
|---|---|
| Room | SGE03 |
| Conveners / Chairs |
|
| Synopsis | This session is a part of the “Reshaping Future Mobility” series at EKC 2025. Mobility is a key part of daily life, enabling people to connect, learn, and access resources for healthcare and more. We will explore recent advancements in ICT technologies and discuss how these can work together to create a more connected, enriched, and sustainable society.
Key topics include the following but not limited to:
• ICT technologies transforming the way we access culture, shopping, education, and healthcare
• ICT technologies redefining mobility with innovations like vehicle sharing, self-driving taxis, and air taxis; and enhancing existing transportation systems with optimal scheduling and smarter routing.
|
| Speakers |
|
